The Active Business Company GmbH offers SOI (Silicon on Insulator)-Wafer with multiple specifications, e.g. Thick-Film-SOI with a device layer of <1,5 µm as well as Thin-Film-SOI with a device layer of >1,5 µm.
Typical Specifications:
| |
Thick-Film-SOI: |
Thin-Film-SOI: |
 |
| Technology used |
Bonding and Polishing |
SIMOX |
| Diameters |
4" - 8" |
4" - 8" |
| Device Layer Thickness |
3 µm - 100 µm |
0,05 µm - 1 µm |
| Buried Oxyde |
0,05 µm - 10 µm |
0,05 µm - 0,4 µm |
| Handle Wafer Thickness |
300 µm - 725 µm |
300 µm - 725 µm |
|
|
|
|
|
|
|
|
|
We supply SOI-Wafers according your requirement in a variety of specifications. In case of any questions please do not hesitate to contact us. A quote can be requested directly by filling out our request form.
|